Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems
AMICRA Microtechnologies GmbH
We provide customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including:active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, opto electronics, and MEMS.
Die Bonders / Flip Chip Bonders
- AFCPlus Die Bonder / Flip Chip Bonder
- NovaPlus Die Bonder / Flip Chip Bonder
- NovaFanOut Die Bonder / Flip Chip Bonder
Wafer Inking Sytems
Dispensing and Test Systems
Upcoming Trade Shows:
- SEMICON South East Asia
April 22-24, Booth: 104
- ECTC 2015
San Diego, California
May 27-28, Booth: 700
- SEMICON West 2015
San Francisco, CA
July 14-16, Booth: N. Hall 6273
- SEMICON Taiwan 2015
Sep 2-4, Booth: 1070
- China International Optoelectronic Expo
Sep 2-5, Booth: 1112
- ECOC 2015
Sept. 28-30, Booth:521
- IWLPC 2015
San Jose, CA
Oct. 14-15, Booth:11
- IMAPS Int. Symposium on Microelectronics
Oct. 27-28, Booth: 217
In just under a month, AMICRA will be exhibiting for the first time at SEMICON Southeast Asia 2015...
AMICRA will be exhibiting from booth: 1209 at the OFC 2015 (Optical Fiber Communication Conference...
AMICRA Managing director, Dr. Johann Weinhaendler, and Director of US Business Development, Walter...