Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems
AMICRA Microtechnologies GmbH
We provide customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including:active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, opto electronics, and MEMS.
Die Bonders / Flip Chip Bonders
- AFCPlus Die Bonder / Flip Chip Bonder
- NovaPlus Die Bonder / Flip Chip Bonder
- NovaFanOut Die Bonder / Flip Chip Bonder
Wafer Inking Sytems
Dispensing and Test Systems
Upcoming Trade Shows:
- SEMICON South East Asia
April 22-24, Booth: 104
- ECTC 2015
San Diego, California
May 27-28, Booth: 700
- SEMICON West 2015
San Francisco, CA
July 14-16, Booth: N. Hall 6273
- SEMICON Taiwan 2015
Sep 2-4, Booth: 1070
- China International Optoelectronic Expo
Sep 2-5, Booth: 1112
- ECOC 2015
Sept. 28-30, Booth:521
- IWLPC 2015
San Jose, CA
Oct. 14-15, Booth:11
AMICRA will be exhibiting from booth: 1209 at the OFC 2015 (Optical Fiber Communication Conference...
AMICRA Managing director, Dr. Johann Weinhaendler, and Director of US Business Development, Walter...
The NOVAFanOut Product page is now online and the correpsonding brochure available to download. To...