AMICRA Microtechnologies

We provide our valued customers with extraordinary high-technology engineering services and products for the whole industry field of microelectronics, such as Semiconductor Backend, Fiber Optic, LED, Optical Sensors, Optoelectronic, MEMS, RFID.

With our latest technology for Flip Chip and Die attach applications we are able to optimize your bond process for the cost reduction of the back-end packaging.

• Placement equipment for advanced Micro & Nano bond applications
• Hardware and Software for leading-edge automation technology
• Digital image processing systems
• Customized machine controls