more than precision

Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems

AMICRA Microtechnologies GmbH

We provide customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including:active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, opto electronics, and MEMS.

Interested in our products (High precision Die Bonder / Flip Chip Bonders, Wafer Inking Systems, Dispensing and Test Systems) and services? Our professional team of experienced engineers worldwide is waiting for your call.

Upcoming Trade Shows:


  • SEMICON South East Asia
    Penang, Malaysia
    April 22-24, Booth: 104
  • ECTC 2015
    San Diego, California
    May 27-28, Booth: 700
  • SEMICON West 2015
    San Francisco, CA
    July 14-16, Booth: N. Hall 6273
  • SEMICON Taiwan 2015
    Taipei, Taiwan
    Sep 2-4, Booth: 1070
  • China International Optoelectronic Expo
    Shenzhen, China
    Sep 2-5, Booth: 1112
  • ECOC 2015
    Valencia, Spain
    Sept. 28-30, Booth:521
  • IWLPC 2015
    San Jose, CA
    Oct. 14-15, Booth:11
  • IMAPS Int. Symposium on Microelectronics
    Orlando, FL
    Oct. 27-28, Booth: 217

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AMICRA to exhibit at SEMICON Southeast Asia 2015

In just under a month, AMICRA will be exhibiting for the first time at SEMICON Southeast Asia 2015...  

AMICRA at OFC 2015

AMICRA will be exhibiting from booth: 1209 at the OFC 2015 (Optical Fiber Communication Conference...  

AMICRA exhibiting at IMAPS- 11th International Conference and Exhibition on Device Packaging

AMICRA Managing director, Dr. Johann Weinhaendler, and Director of US Business Development, Walter...