Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems
AMICRA Microtechnologies GmbH
Providing customers with the latest High-Precision Die Bonder and Flip Chip Bonder technology, as well as products for the entire microelectronics industry field, including: Active Optical Cable, Fan-Out, TSV, TCB, Process Development, Semiconductor Backend, Fiber Optic, LED, Optoelectronics and MEMS.
Die Bonders / Flip Chip Bonders
Wafer Inking Sytems
Dispensing and Test Systems
Upcoming Trade Shows:
San Francisco, California
March 11-13, 2014
- IMAPS Int. Exhibition on Device Packaging
Scottsdale/Fountain Hills, Arizona USA
March 11-12, 2014
Lake Buena Vista, Florida
May 27-30, 2014
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A feature article on AMICRA's NOVA Plus die bonder and flip chip bonder and AFC Plus die bonder and...
Representatives from AMICRA Microtechnologies will be onhand at the International Wafer-Level...
Please come by and visit AMICRA at Productronica in Munich, Germany from 12-15 November, 2013 at...