Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems
AMICRA Microtechnologies GmbH
AMICRA Microtechnologies is a worldwide leading supplier of Die Attach Equipment specializing in submicron placement accuracy (±0.5µm@3s). Our equipment offering supports both Die Attach and Flip Chip bonding processes including the following capability: in-situ eutectic bonding, dynamic alignment, heated tool, pulse heating, laser heating, volumetric and jet dispensing, active bond force control, high speed solutions, in-situ UV curing, 550x600mm bonding area, quantitative tilt calibration system, etc. Other products include: High Speed Wafer Inking and inspection, Automated LED/LD Test & Sort Systems, Gel Fill Line and Custom Solutions.
Our market focus includes: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP.
Die Bonders / Flip Chip Bonders
- AFCPlus Die Bonder / Flip Chip Bonder
- NovaPlus Die Bonder / Flip Chip Bonder
- NovaFanOut Die Bonder / Flip Chip Bonder
Wafer Inking Sytems
Dispensing and Test Systems
Upcoming Trade Shows:
- ECTC 2015
San Diego, California
May 27-28, Booth: 700
- SEMICON West 2015
San Francisco, CA
July 14-16, Booth: N. Hall 6273
- China International Optoelectronic Expo
Aug 31-Sept 2, Booth: 1112
- SEMICON Taiwan 2015
Sep 2-4, Booth: 1070
- ECOC 2015
Sept. 28-30, Booth:521
- IWLPC 2015
San Jose, CA
Oct. 14-15, Booth:11
- IMAPS Int. Symposium on Microelectronics
Oct. 27-28, Booth: 217
Nov. 10-13, Booth: B3.306
During the last week of May, AMICRA will be returning to exhibit our high-precision die bonders at...
In just under a month, AMICRA will be exhibiting for the first time at SEMICON Southeast Asia 2015...
AMICRA will be exhibiting from booth: 1209 at the OFC 2015 (Optical Fiber Communication Conference...