more than precision

Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems

AMICRA Microtechnologies GmbH

We provide customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including:active optical cable, fan-out, TSV, TCB, process development, semiconductor backend, fiber optic, LED, opto electronics, and MEMS.

Interested in our products (High precision Die Bonder / Flip Chip Bonders, Wafer Inking Systems, Dispensing and Test Systems) and services? Our professional team of experienced engineers worldwide is waiting for your call.

Upcoming Trade Shows:

  • SEMICON Taiwan 2014
    Taipei City, Taiwan
    Sept. 3-5, Booth: 1270
  • ECOC 2014
    Cannes, France
    Sept. 22-24, Booth: 527
  • iMAPS Int. Symposium on Microelectronics
    San Diego, California
    Oct. 13-16, Booth: 330
  • IWLPC
    San Jose, California
    Nov. 11-13, Booth: 11

2015

  • OFC 2015
    Los Angeles, CA, USA
    March 24-26, Booth: 1209
  • ECTC 2015
    San Diego, California
    May 27-28, Booth: 700
  • SEMICON West 2015
    San Francisco, CA
    July 14-16, Booth: N. Hall 6273

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News

New Sales Distributor in the Philippines

AMICRA is happy to announce Globaltech Automation, Inc. as the newest addition to our Asian sales...  

Exhibiting at SEMICON WEST 2014

In just under a month, AMICRA will be exhibiting from Booth 6260 located in the North Hall of the...  

AMICRA at ECTC 2014

Stop by Booth#219 from May 28th-29th, 2014 at the 64th Electronic Components and Technology...