Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems
AMICRA Microtechnologies GmbH
AMICRA Microtechnologies is a worldwide leading supplier of Die Attach Equipment specializing in submicron placement accuracy (±0.5µm@3s). Our equipment offering supports both Die Attach and Flip Chip bonding processes including the following capability: in-situ eutectic bonding, dynamic alignment, heated tool, pulse heating, laser heating, volumetric and jet dispensing, active bond force control, high speed solutions, in-situ UV curing, 550x600mm bonding area, quantitative tilt calibration system, etc. Other products include: High Speed Wafer Inking and inspection, Automated LED/LD Test & Sort Systems, Gel Fill Line and Custom Solutions.
Our market focus includes: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP.
Die Bonders / Flip Chip Bonders
- AFCPlus Die Bonder / Flip Chip Bonder
- NovaPlus Die Bonder / Flip Chip Bonder
- NovaFanOut Die Bonder / Flip Chip Bonder
Wafer Inking Sytems
Dispensing and Test Systems
Upcoming Trade Shows:
- SEMICON West 2015
San Francisco, CA
July 14-16, Booth: N. Hall 6273
- China International Optoelectronic Expo
Aug 31-Sept 2, Booth: 1112
- SEMICON Taiwan 2015
Sep 2-4, Booth: 1070
- ECOC 2015
Sept. 28-30, Booth:521
- IWLPC 2015
San Jose, CA
Oct. 14-15, Booth:11
- IMAPS Int. Symposium on Microelectronics
Oct. 27-28, Booth: 217
Nov. 10-13, Booth: B3.306
- OFC 2016
Mar. 22-24, Booth: 3100
- ECTC 2016
Las Vegas, NV
June 1-2, Booth: 214
Our latest advertisement for our ultra high precision die & flip chip bonders for semiconductor...
AMICRA will be returning again this year to exhibit at the SEMICON West 2015 held at the Moscone...
During the last week of May, AMICRA will be returning to exhibit our high-precision die bonders at...