more than precision

Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems

AMICRA Microtechnologies GmbH

Providing customers with the latest High-Precision Die Bonder and Flip Chip Bonder technology, as well as products for the entire microelectronics industry field, including: Active Optical Cable, Fan-Out, TSV, TCB, Process Development, Semiconductor Backend, Fiber Optic, LED, Optoelectronics and MEMS.

Interested in our products (High precision Die Bonder / Flip Chip Bonders, Wafer Inking Systems, Dispensing and Test Systems) and services? Our professional team of experienced engineers worldwide is waiting for your call.

Upcoming Trade Shows:


  • ECTC
    Lake Buena Vista, Florida
    May 27-30, Booth: 219
  • SEMICON West 2014
    San Francisco, California
    July 8-10, Booth: N. Hall 6260
  • iMAPS Int. Symposium on Microelectronics
    San Diego, California
    Oct. 13-16, Booth: 330
    San Jose, California
    Nov. 11-13, Booth: 11


  • OFC 2015
    Los Angeles, CA, USA
    March 24-26, Booth: 1209

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Large panel fan-out wafer-level packaging: accuracy is king

AMICRA article in Chip Scale Review (March/April 2014)  

Leading Optical Device Subcon in Thailand select AFC Plus

We are pleased to announce that a leading optical device Subcon in Thailand selected the AFCPlus...  

Order from Germany for NOVA Plus System

AMICRA is happy to share that an order has been received from Germany for the NOVAPlus die bonder...