more than precision

Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems

AMICRA Microtechnologies GmbH

We provide customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including:active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, opto electronics, and MEMS.

Interested in our products (High precision Die Bonder / Flip Chip Bonders, Wafer Inking Systems, Dispensing and Test Systems) and services? Our professional team of experienced engineers worldwide is waiting for your call.

Upcoming Trade Shows:

  • ECOC 2014
    Cannes, France
    Sept. 22-24, Booth: 527
  • iMAPS Int. Symposium on Microelectronics 2014
    San Diego, California
    Oct. 14-16, Booth: 330
  • IWLPC 2014
    San Jose, California
    Nov. 11-13, Booth: 11

2015

  • iMAPS Int. Device Packaging Exhibition 2015
    Fountain Hills, AZ, USA
    March 17-18, Booth: 6
  • OFC 2015
    Los Angeles, CA, USA
    March 24-26, Booth: 1209
  • SEMICON South East Asia
    Penang, Malaysia
    April 22-24, Booth: 104
  • ECTC 2015
    San Diego, California
    May 27-28, Booth: 700
  • SEMICON West 2015
    San Francisco, CA
    July 14-16, Booth: N. Hall 6273

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News

Appearance in Economic Daily News (Taiwan)

An article on the AMICRA die and flip chip bonders was featured in an article in Economic Daily...  

AMICRA at ECOC 2014

In just under two weeks (Sept. 22-24, 2014), AMICRA will be exhibiting from Booth 527 at ECOC 2014...  

Feature in "SiS" Executive View

An article by AMICRA Managing Director, Dr. Johann Weinhändler, discussing silicon photonics is...