more than precision

Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems

AMICRA Microtechnologies GmbH

We provide customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including:active optical cable, fan-out, TSV, TCB, process development, semiconductor backend, fiber optic, LED, opto electronics, and MEMS.

Interested in our products (High precision Die Bonder / Flip Chip Bonders, Wafer Inking Systems, Dispensing and Test Systems) and services? Our professional team of experienced engineers worldwide is waiting for your call.

Upcoming Trade Shows:


  • SEMICON Taiwan 2014
    Taipei City, Taiwan
    Sept. 3-5, Booth: 1270
  • ECOC 2014
    Cannes, France
    Sept. 22-24, Booth: 527
  • iMAPS Int. Symposium on Microelectronics
    San Diego, California
    Oct. 13-16, Booth: 330
  • IWLPC
    San Jose, California
    Nov. 11-13, Booth: 11

2015

  • OFC 2015
    Los Angeles, CA, USA
    March 24-26, Booth: 1209

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News

Exhibiting at SEMICON WEST 2014

In just under a month, AMICRA will be exhibiting from Booth 6260 located in the North Hall of the...  

AMICRA at ECTC 2014

Stop by Booth#219 from May 28th-29th, 2014 at the 64th Electronic Components and Technology...  

Large panel fan-out wafer-level packaging: accuracy is king

AMICRA article in Chip Scale Review (March/April 2014)