more than precision

Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems

AMICRA Microtechnologies GmbH

AMICRA Microtechnologies is a worldwide leading supplier of Die Attach Equipment specializing in submicron placement accuracy (±0.5µm@3s). Our equipment offering supports both Die Attach and Flip Chip bonding processes including the following capability: in-situ eutectic bonding, dynamic alignment, heated tool, pulse heating, laser heating, volumetric and jet dispensing, active bond force control, high speed solutions, in-situ UV curing, 550x600mm bonding area, quantitative tilt calibration system, etc. Other products include: High Speed Wafer Inking and inspection, Automated LED/LD Test & Sort Systems, Gel Fill Line and Custom Solutions.   

Our market focus includes: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP.

Interested in our products (High precision Die Bonder / Flip Chip Bonders, Wafer Inking Systems, Dispensing and Test Systems) and services? Our professional team of experienced engineers worldwide is waiting for your call.

Upcoming Trade Shows:


  • ECTC 2015
    San Diego, California
    May 27-28, Booth: 700
  • SEMICON West 2015
    San Francisco, CA
    July 14-16, Booth: N. Hall 6273
  • China International Optoelectronic Expo
    Shenzhen, China
    Aug 31-Sept 2, Booth: 1112
  • SEMICON Taiwan 2015
    Taipei, Taiwan
    Sep 2-4, Booth: 1070
  • ECOC 2015
    Valencia, Spain
    Sept. 28-30, Booth:521
  • IWLPC 2015
    San Jose, CA
    Oct. 14-15, Booth:11
  • IMAPS Int. Symposium on Microelectronics
    Orlando, FL
    Oct. 27-28, Booth: 217
  • Productronica
    Munich, Germany
    Nov. 10-13, Booth: B3.306

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Exhibitor at ECTC 2015

During the last week of May, AMICRA will be returning to exhibit our high-precision die bonders at...  

AMICRA to exhibit at SEMICON Southeast Asia 2015

In just under a month, AMICRA will be exhibiting for the first time at SEMICON Southeast Asia 2015...  

AMICRA at OFC 2015

AMICRA will be exhibiting from booth: 1209 at the OFC 2015 (Optical Fiber Communication Conference...