more than precision

Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing & Test Sytems

AMICRA Microtechnologies GmbH

We provide customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including:active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, opto electronics, and MEMS.

Interested in our products (High precision Die Bonder / Flip Chip Bonders, Wafer Inking Systems, Dispensing and Test Systems) and services? Our professional team of experienced engineers worldwide is waiting for your call.

Upcoming Trade Shows:


  • European 3D/TSV Summit
    Grenoble, France
    January 19-21, Booth: 9
  • iMAPS Int. Device Packaging Exhibition 2015
    Fountain Hills, AZ, USA
    March 17-18, Booth: 6
  • OFC 2015
    Los Angeles, CA, USA
    March 24-26, Booth: 1209
  • SEMICON South East Asia
    Penang, Malaysia
    April 22-24, Booth: 104
  • ECTC 2015
    San Diego, California
    May 27-28, Booth: 700
  • SEMICON West 2015
    San Francisco, CA
    July 14-16, Booth: N. Hall 6273
  • China International Optoelectronic Expo
    Shenzhen, China
    Sep 2-5, Booth: 1112
  • ECOC 2015
    Valencia, Spain
    Sept. 28-30, Booth:521

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AMICRA Managing Director, Dr. Johann Weinhaendler and Regional Sales Manager, Mr. Joe Ettipio, will...  

AMICRA Welcomes Joe Ettipio as Sales Manager for the U.S. Western Region

AMICRA Microtechnologies GmbH is pleased to announce the newest addition to its sales management...  

Order from multinational telecommunications equipment company

AMICRA Microtechnologies is pleased to announce that a multi-million dollar order has been received...