SDB 1000

SEMI AUTOMATIC HIGH ACCURACY MICRO ASSEMBLY CELL

• Accuracy +/- 0.5 µm @ 3S, cycle - time < 60 sec*
• Eutectic laser soldering or epoxy bonding
• Optional FlipChip Bonding, Wafer Mapping, Post bond inspection

Markets

• Micro optics, LED and MEMS assembly
• R&D and low volume production
• R&D for advanced packaging