Nova Plus

HIGH SPEED DUAL HEAD DIE BONDER

• Accuracy +/- 3µm @ 3s, Cycle- time < 3 sec*
• Modular machine concept for all micro assembly applications
• Eutectic laser soldering or epoxy bonding
• Multi Flip Chip Bonding, Wafer Mapping, Post bond inspection 

Markets

• Semiconductor advanced packaging (TSV, eWLB, Fan-Out, WLP, 3D, Stack Die)
• MEMS, Automotive Sensors, RFID, LED, Optoelectronic