AFC

FULLY AUTOMATIC HIGH ACCURACY MICRO ASSEMBLY CELL

• Accuracy +/- 0.5 µm @ 3S, Cycle - time < 30 sec*
• Eutectic laser soldering or epoxy bonding
• Optional FlipChip Bonding, Wafer Mapping, Post bond inspection

Markets

• Micro optics, LED and MEMS assembly
• Semiconductor advanced packaging (3D, Stack Die etc.)
• Dedicated for volume production