Our success is based on the true "partner-relationship" with our customers, utilizing our core competencies in equipment and software design, development and production.

Our state-of-the-art high accuracy SDB & AFC Micro Assembly cell can be used for Die & Flip Chip application as well as for all kind of micro/nano assembly applications. The systems are designed for an ultra high accuracy bonding of +/- 500 nm.

Our new NOVA Die Attach & Flip Chip system offers the combination of a high accuracy (+/- 3μm@3s) and high speed (< 3 sec) as well as different kind of bond process such as Epoxy, Eutectic, Laser bonding. With our high speed semi automatic (SIS) and fully automatic wafer inks (AIS) system we have set standards for the industry.

In addition to our standard products, AMICRA also offers a strong competence for customized solutions for Laser Lift off applications, Gel Dispensing lines, LED inspection & testing as well as for line integrations.