History

2009

• September 2009: execution of a exclusive distribution agreement with Schmidtek Ltd. for the sales territory Taiwan  
• June 2009: execution of a exclusive distribution agreement with Caleo S.A. for the sales territories of France, Spain, Portugal, and Morocco.
• June 2009: execution of a exclusive distribution agreement with Interlec AG for the sales territory Switzerland
• April 2009: execution of a distribution agreement with WKK for the sales territories Singapore, Malaysia, and Thailand.
• Feb 2009: Dr. Johann Weinhändler joins the management team as head of sales, marketing and business development.
• Trade shows: OFC (USA), SMT, Semicon Singapore

2008

• 12/2008 Restructuring of the ownership structure including recapitalization
• 08/2008 New company head office (Wernerwerkstr. 4)
• 2 AFC die bonders for MEMS Probecard (Korea)
• Follow-up orders for AFC Flip Chip
• Follow-up orders for the laser process system (LPS)
• Trade shows: OFC (USA), SMT, Semicon Taiwan

2007

• Complete dispenser production line for pressure sensors
• Order for AFC Flip Chip (Canada)
• Follow-up orders for AIS
• Development of the laser lift off system (LPS)
• Trade shows: SMT, Laser 2007, Productronica

2006

• Delivery of a complete production line with high speed die bonder NOVA
• Follow-up orders for AIS
• Process development bubble-free silicon membrane
• Automatic measuring system for silicon membrane
• Trade shows: SMT, Optatec

2005

• Development of AIS (high speed inking with wafer robot)
• Development commencement of the high speed die bonder
• Trade shows: Laser 2005, SMT, Produtronica

2004

• Development of the AFC Flip Chip
• Development of a fully automatic lens characterization system
• Trade shows: Hannover Messe (Microsystems technology), SMT

2003

• Development of the HIGH SPEED Wafer Inking System
• Development of the AFC Flip Chip
• Trade shows: SMT, Laser 2002, Productronica

2001 / 2002

• Establishment of AMICRA Microtechnologies GmbH by Rudolf Kaiser and Horst Lapsien
• Developments for ADB2000 und SDB1000
• Trade shows: ECOC 2001 Amsterdam; ECOC 2002 Copenhagen

1995 - 2000 (Gefasoft)

• Development by Rudolf Kaiser and Horst Lapsien of a high-precision die bonder for Siemens Fiberoptics in cooperation with several other partners.