History

History

2009

  • September 2009: execution of a exclusive distribution agreement with Schmidtek Ltd. for the sales territory Taiwan  
  • June 2009: execution of a exclusive distribution agreement with Caleo S.A. for the sales territories of France, Spain, Portugal, and Morocco.
  • June 2009: execution of a exclusive distribution agreement with Interlec AG for the sales territory Switzerland
  • April 2009: execution of a distribution agreement with WKK for the sales territories Singapore, Malaysia, and Thailand.
  • Feb 2009: Dr. Johann Weinhändler joins the management team as head of sales, marketing and business development.
  • Trade shows: OFC (USA), SMT, Semicon Singapore

2008

  • 12/2008 Restructuring of the ownership structure including recapitalization
  • 08/2008 New company head office (Wernerwerkstr. 4)
  • 2 AFC die bonders for MEMS Probecard (Korea)
  • Follow-up orders for AFC Flip Chip
  • Follow-up orders for the laser process system (LPS)
  • Trade shows: OFC (USA), SMT, Semicon Taiwan

2007

  • Complete dispenser production line for pressure sensors
  • Order for AFC Flip Chip (Canada)
  • Follow-up orders for AIS
  • Development of the laser lift off system (LPS)
  • Trade shows: SMT, Laser 2007, Productronica

2006

  • Delivery of a complete production line with high speed die bonder NOVA
  • Follow-up orders for AIS
  • Process development bubble-free silicon membrane
  • Automatic measuring system for silicon membrane
  • Trade shows: SMT, Optatec

2005

  • Development of AIS (high speed inking with wafer robot)
  • Development commencement of the high speed die bonder
  • Trade shows: Laser 2005, SMT, Produtronica

2004

  • Development of the AFC Flip Chip
  • Development of a fully automatic lens characterization system
  • Trade shows: Hannover Messe (Microsystems technology), SMT

2003

  • Development of the HIGH SPEED Wafer Inking System
  • Development of the AFC Flip Chip
  • Trade shows: SMT, Laser 2002, Productronica

2001 / 2002

  • Establishment of AMICRA Microtechnologies GmbH by Rudolf Kaiser and Horst Lapsien
  • Developments for ADB2000 und SDB1000
  • Trade shows: ECOC 2001 Amsterdam; ECOC 2002 Copenhagen

1995 - 2000 (Gefasoft)

  • Development by Rudolf Kaiser and Horst Lapsien of a high-precision die bonder for Siemens Fiberoptics in cooperation with several other partners.

More Information

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